INTEGRAL SXEMALARNING ZAMONAVIY INTEGRATSIYASI: CHIPLET, 2.5D/3D VA HETEROGEN QADOQLASH TEXNOLOGIYALARINING RIVOJLANISH TENDENSIYALARI
Keywords:
integral sxema, chiplet, 2.5D integratsiya, 3D IC, heterogen integratsiya, advanced packaging, UCIe, hybrid bonding, interposer.Abstract
Maqolada integral sxemalarni rivojlantirishning post-Moore bosqichidagi chiplet, 2.5D, 3D va heterogen integratsiya yondashuvlari tahlil qilinadi. Monolit kristallni kattalashtirishga nisbatan kichik funksional kristallarni bitta korpusda birlashtirishning ishlab chiqarish chiqishi, funksional moslashuvchanlik va texnologik jarayonlarni aralashtirish bo‘yicha afzalliklari ko‘rsatilgan. Die-to-die ulanish, interposer, fan-out, through-silicon via, hybrid bonding va UCIe kabi yechimlarning vazifalari umumlashtirilgan. Shu bilan birga, issiqlik tarqalishi, quvvat yetkazib berish, signal yaxlitligi, ESD, testlash va known-good-die muammolari tizim darajasidagi asosiy cheklovlar sifatida ko‘rib chiqilgan. Zamonaviy advanced packaging texnologiyalari integral sxemalarning unumdorligini faqat tranzistorni kichraytirish orqali emas, tizim integratsiyasi orqali oshirish imkonini berishi asoslangan.
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